Infineon - Future and Strategy
Tuesday, July 1, 2008
[Originally for Sramana Mitra's site]
Over the past two weeks, we have looked at Infineon’s financials and various business units. Before we proceed to its valuation, it will be useful to examine the company’s key strategic initiatives and growth possibilities if we exclude Qimonda from the picture.
Infineon states its strategic objectives clearly in its 2007 annual report. The company hopes to leverage its strength in energy efficiency and security to remain a semiconductor leader. It sees the growing need for mobility and communications as the drivers for its own growth. As the company is betting on mobile phones and broadband customer premises equipment markets, it recognizes the need to make strategic acquisitions to strengthen these segments.
The company also opts for a mixed manufacturing model. The German chipmaker wishes to retain control over process technologies for RF, power, embedded flash and others that it considers its traditional strengths. For standard CMOS processes, however, it will engage in long-term strategic partnerships with other companies while extensively using the services of silicon foundries.
I see a lot of positives in the company’s strategic plan. Its focus on strengths such as energy efficiency and its choice of an optimal manufacturing strategy are especially commendable. Given its portfolio, the mobile and the carrier markets are obvious growth drivers. Infineon, however, needs to take care as it is pitted against most other semiconductor leaders in these markets, including TI, Qualcomm, Broadcom and STM. Also, while it is certainly a leader in low-power technology and system integration, the competition is rapidly narrowing the gap given the increased thrust towards mobility and convergence.
It also appears that with Ziebart’s exit as CEO, Infineon’s strategy of making small but solid acquisitions may change. I am guessing that the company will now engage in larger M&A activities to gain scale, much along the lines of STM’s recent move to get NXP’s wireless business. The prime candidate being discussed is NXP. An Infineon-NXP merger would create an automobile and industrial semiconductor juggernaut.
With regards to wireless, Infineon’s acquisition of LSI’s mobility business was well motivated: LSI not only offered a sustained baseband program but also brought in substantial 3G IP from Agere to Infineon. Still, as I mentioned in the previous piece, Infineon lacks a full product portfolio to build a complete mobile platform.
This is where a merger with Freescale becomes a viable option. Freescale has its own baseband solutions for UMTS, EDGE and GSM/GPRS. More importantly, it not only has application processor capabilities, but it also delivered the industry’s first single-core modem architecture and has already embarked on long-term evolution (LTE) development. The complementary R&D that Freescale can add to Infineon’s low-power strength can, in my mind, create a powerful mobile wireless entity.
While these are good synergies, the two companies still do not have a complete connectivity portfolio between them. Infineon will probably need to follow a hybrid acquisition strategy, combining the merits of Ziebart’s philosophy while going for scale through Freescale and/or NXP. The company should perhaps go for small acquisitions or long-term strategic partnerships for connectivity solutions to secure and grow its mobile market share.
I also think that with its unique strengths in energy efficiency and low-power electronics, Infineon should look actively into Zigbee and smart energy systems as a diversification area. I believe that smart energy is a burgeoning industry and Infineon, among the semiconductor giants, is best positioned to exploit this growth.
In this post I have looked at various strategic directions and initiatives for Infineon. I have also put forth my vision for the company. With this thorough analysis behind us, we turn to the company’s valuation in the concluding part of this series.
Nokia to use IDCC products in future?
Wednesday, June 4, 2008
With Nokia and InterDigital (IDCC) engaged in a prolonged legal battle over licensing issues, the title of this article is sure to raise more than a few eyebrows. I think that recent industry events make this an interesting but overlooked possibility. Here is why –
The IDCC-NXP connection: NXP has licensed IDCC’s 3G HSDPA ASIC design for its PNX6712 chip. The companies entered into this agreement for integration into NXP’s Nexperia cellular chipsets as early as August 2005. Talking about this during InterDigital’s 1st quarter 2008 conference call, its CFO Scott McQuilkin said, “We also completed our delivery of HSDPA technology to NXP and ASIC is now moving into production.”
The NXP-STM connection: STM and NXP entered into a JV last month merging their wireless businesses to acquire scale. You can read my extensive coverage of this event here and here. The formation of a solid number three player stints IDCC’s abilities to sell its SlimChip solution directly. But in the bigger scheme of things, it spells good news for the King of Prussia-based company as the JV widens its footprint. In the most recent quarter conference call, IDCC’s CEO William Merritt resonated this point saying, “Frankly we looked at the combination of ST Micro and NXP and said, ‘Great, they’re getting stronger and they have our IP’ and we love our licensees to be strong and pushing hard into the market..”
The STM-Nokia connection: Nokia last year decided on a multi-vendor sourcing strategy. It now sources 3G from both TI and STM. Additionally, it also transferred about 200 chipset design engineers to STM. This not only signals Nokia’s move away from chipset design, but also presents STM with the opportunity to grab more 3G business at Nokia. It is devoting R&D resources to baseband design and NXP’s team and product are an active part of the equation.
Labels: HSDPA, Interdigital, Nokia, NXP, ST Microelectronics, STM
Infineon - more consolidation?
Wednesday, May 28, 2008
Ziebart, it is said, was a proponent of small acquisitions and organic growth. His exit seems to have come after internal management disagreements. With Ziebart gone, the doors are now open for larger mergers directed towards consolidation along the lines of the recent STM-NXP JV. One of the possibilities being floated around is a merger with NXP. Another possibility is a wireless JV with Freescale. Also, these possibilities are not mutually exclusively either.
Infineon, much like STM, has been in financial pains. The company (exclusing Ziebart) seems to be bitten by the European consolidation bug. The way I see it, Europe is consolidating its technology value chain and some changes in Infineon's strategy and management philosophy are inevitable.
I would opt for a mixed strategy. The small acquisition and calculated growth path that Ziebart believed is a good way to grow market share in new segments. This is also the strategy that another semiconductor giant, Texas Instruments is opting for. A Freescale JV to gain scale and compete effectively in wireless can complement this strategy.
But undoubtedly, the political and legal environment in Europe makes the NXP merger a real possibility as well. I repeat, European semiconductor manufacturers and the value chain are consolidating, and Infineon will be an active part of the big picture. So, don't be surprised if you see more mergers later this year.
ST Microelectronics - Valuation
Tuesday, May 27, 2008
[Originally for Sramana Mitra's site]
I value ST Microelectronics at just under $15 per share. This is about 30% more than its current value. Its strengths include its broad portfolio, its position in the strengthening European block and its resultant wireless business outlook. The operating constraints caused by STM’s geopolitical ties are growth deterrents. Its commitment to the IDM model can make it tough to compete effectively against the crop of nimble fabless companies.
While STM has been in the news recently for its wireless moves, its product portfolio extends from consumer goods to industrial automation solutions. Its IMS business will remain a steady revenue source. Its MEMS products are an important part of the highly successful Nintendo Wii. The company continues to supply advanced analog components and energy management solutions for various industrial applications. The IMS also offers growth drivers that STM is yet to address aggressively. The analog market has a TAM of around $37 billion that STM can look at once it has its wireless business logistics worked out.
Its wireless business, it appears to me, is increasingly becoming Europe and Nokia-centric. The company’s success and growth in wireless relies to a large extent on how it can bootstrap itself to Nokia’s success. While it has a good rapport with the Finnish-handset company, it cannot afford complacency. With Broadcom pushing as well to grab TI’s share as well through an aggressive product and pricing strategy, STM’s task is cut out. It has to anticipate and meet Nokia’s needs, being ready in the process to take further margin cuts.
The IDM model and Europe's labor laws will keep STM from reaping the full benefits of its wireless outlook. Its gross margins are below industry average at a low 35%. While the company is taking great efforts to become less capital-intensive, I am not sure how much more manufacturing efficiency the company can eke out. The divesting and merger activities to gain scale will provide some reprieve though.
In conclusion, I think STM is well-positioned in the wireless market to displace TI from its second position. But since this will not come at increased efficiency and margins, it does not increase the company’s value dramatically. While I am both curious and enthusiastic about STM’s wireless future, I will shy away from investing in the company just given the baggage it appears to come with.
Read the full article>>ST Microelectronics - NXP JV
Sunday, May 25, 2008
[Originally for Sramana Mitra's site]
In the last part of this series, we looked at STM’s strategic initiatives that are aimed at making the company more nimble and profitable. A very important part of this strategy was unveiled last month when the company decided to form a Joint venture with its wireless business and that of NXP. Before moving on to STM’s wireless business and outlook, it is important to understand the dynamics behind this move.
As per the deal, STM will have control on the JV with about 80% stake. The company will pay NXP $1.55bn to close the deal in the third quarter. With revenue totaling about $3bn in 2007, the JV had about 10 percent of the global market, according to iSuppli. Besides, the synergies are expected to save up to $250mn in 2011.
While STM has steadily encroached into TI’s market share by denting its Nokia and EMP 3G accounts, NXP is a 2/2.5G supplier to tier-1 and tier-2 vendors including Samsung. Besides the scale, the JV will have a strong IP position with over 3500 patent families. This, in turn, gives it greater negotiating power in IP cross-licensing discussions further increasing its margins.
Besides establishing a strong R&D team focusing on media convergence and energy management, the JV now has a complete portfolio of connectivity solutions. These technologies – WiFi, Bluetooth, FM and GPS - will be integral to tomorrow’s convergence devices. These connectivity solutions complement the company’s baseband, application processor and RF products, allowing the company to offer them as part of a state-of-the-art single stop mobile platform. For more details on the STM-NXP JV and its effects on the wireless industry, I will direct the interested reader to my articles here and here.
The wireless industry, especially the 3G chip vendor space, will consolidate and the stronger players will pick themselves out of the crowd. The JV is STM’s statement of arrival. Over the last couple of years it has made tremendous strides culminating in design wins from Nokia and Sony Ericsson. The JV will perhaps not make an immediate impact in its product line. It, however, expands its customer base and also positions STM to exploit the convergence market over the next few years.
Read the full article>>Labels: Bluetooth, GPS, NXP, ST Microelectronics, STM, Wi-Fi
Icera another option for TI
Sunday, May 18, 2008
In my Texas Instruments (TXN) valuation series, I pointed out that the company did not have a strong 3G product strategy. I subsequently also discussed in detail the synergies that existed between InterDigital and TI. I had also noted that if not InterDigital, TI could consider Icera also as a viable option to buttress its 3G roadmap. Let us take a quick look at this possibility.
Bristol-based Icera Semiconductors has one of the better performing HSDPA products in the market today. The company’s soft modems have been gaining traction in the data-cards market. The company recently announced a merger with Sirific Wireless. Sirific’s RF front-end and digital RF expertise is expected to complement Icera’s Livanto soft modems. Icera also announced a mobile phone design win recently. Combined with Sirific, Icera has raised over $200mn till date. The company is also looking to raise another round on the strength of its recently announced design wins and the broader market traction it has been receiving of late. More on Icera can be found here.
Texas Instruments, as I have been lamenting once too often in this blog, does not have its own 3G-baseband roadmap. The ‘foundry’ model worked for the company so far. But with Nokia and Ericsson sourcing from multiple vendors, its situation has become precarious. Besides, Nokia also moved its chipset engineering team to STM which after its recent merger with NXP has become a larger force to reckon with. These industry-events together with Broadcom's (BRCM) aggressive ‘3G on a chip’ campaign spell bad news for TI.
TI has to act soon. Pacts with InterDigital (IDCC) and/or Icera to bundle their baseband solutions with its application processors or even to offer a combined OMAPVox solution are possible. Or, if TI desires, it can attempt to acquire one of these companies. IDCC, with its strong IP is unlikely to be a cheap acquisition target. Besides, there is a chance that IDCC’s patents may only incrementally benefit TI in patent cross-licensing discussions given the latter's already strong IP position.
A good alternative then is to acquire a focused product-centric company such as Icera. With the scale of investments, Icera may be a cheaper option to pursue than IDCC. The company’s expertise in soft modems may complement TI’s own DSP expertise to create niche products for the future. With its support network, TI can leverage this unique technology to stay ahead of its competitors in product launch as well as performance.
Of course, the other question to ask is if either TI or Icera will consider its path. For TI, the RF expertise in Icera may not add much value. So, the UK-based company may have sounded more attractive to TI before the Sirific merger (though an additional $100mn is not much for the semiconductor giant.) Icera, on the other hand, is also positioning for an IPO in the 2010 timeframe and Sirific is seen as a strategic addition in this direction.
While Icera seems to have big plans, TI may also just resign to its dwindling 3G baseband business. With the convergence devices movement slowly heating up, the company also finds itself competing with more players on the applications processor front. So, if it does not buy or partner with someone now, it will have to think ahead, start on 4G and hope that it can recapture any lost market share at that time.
STM + NXP = Unhappy TI, Broadcom?
Tuesday, April 15, 2008
In my last article on the STM, NXP merger, I analyzed the JV from STM’s perspective. The merger is a clear sign of further consolidation in the 3G space. To understand this further, it is also illustrative to look at how other players in the vendor space can be impacted by this merger.
Labels: BroadCom, icera, Infineon, Interdigital, marvell, NXP, QualComm, STM, TI
STM-NXP merger consolidates 3G
Monday, April 14, 2008
ST Microelectronics (STM) and NXP announced last week that they were going to combine their wireless chip manufacturing capabilities to form a joint venture. This is an industry consolidating event that may well define the direction in which the mobile value chain is headed.
As per the deal, structured as a merger, STM will have control on the JV with about 80% stake. The company will pay NXP $1.55bn to close the deal in the third quarter. The merger combines two of the bigger wireless chipmakers, which together had about 10 percent of the global market in 2007, according to iSuppli. STM CEO Carlo Bozotti claimed that the JV will create a global leader with a more optimistic 14% market-share in wireless chips.
The companies’ combined wireless revenue for 2007 was about $3bn. They reported that the synergies are expected to save up to $250mn in 2011. Nokia, Samsung and Sony-Ericsson are among the customers for the JV. The company will primarily compete with Broadcom , and to a lesser degree with Infineon and Freescale, hoping to take market share away from TI. You can read more about TI’s precarious position in the mobile space and how such events aggravate this situation from my valuation series here, here and here.
Bozotti justifies the JV as a move to compete with the giants (Qualcomm and TI) on scale. “This is a business where scale is fundamental,” he says. The economy of scale, both in R&D and manufacturing, gives the leaders substantial ASP gains. The JV will also have a stronger IP position than either STM or NXP. This, in turn, gives it greater negotiating power in IP cross-licensing discussions further increasing its margins.
Besides establishing a strong R&D team to develop 3G solutions and beyond, the joint venture has what I would call a complete portfolio of connectivity solutions. These technologies – WiFi, Bluetooth, FM and GPS - will be integral to tomorrow’s convergence devices. This allows the company to chalk out a product roadmap that integrates these solutions into a state-of-the-art single stop platform that will be attractive to handset vendors.
[Long Qualcomm at the time of writing]
Labels: Bluetooth, NXP, ST Microelectronics, TI, WLAN
SiRF - down but not out
Wednesday, February 6, 2008
While it seems to have come as a major surprise to many analysts who were very bullish about the company earlier, it does not to me. Here is a link to my article back in July where I discuss the tough position that SiRF finds itself in. I wish to re-analyze that article here. Here is the thesis statement I made there -
"I wish to make a bold statement: SiRF will find itself marginalized and out of business if it does not diversify into other wireless technologies or strive to have a tie-up with a cellular or WLAN provider."
I followed it up with these reasons -
- interest shown by cellular companies in GPS: This was even before Atheros made a smart move picking up U-Nav (incidentally, I had stated then that U-Nav would be acquired too) and NXP got GloNav. I also mentioned that SiRF with its $2 billion market cap (then) was too big to be acquired. Now the company finds its value almost reduced to a fourth of that valuation.
- Other companies wanting to grad more silicon: That left SiRF as more of a one-trick pony!
- 'Keep the Bill of Materials low' dictum: Effectively, with more competition comes lower margins. This was something I saw as a critical issue that faced SiRF. Today, this has shown its ugly face with a reduced gross margin that has got the Street scampering.
If SiRF is not wary about the growing influence of mobile GPS, then it could lead to a downward spiral. The Street is perhaps justified in its reaction - the reality about the company and the GPS market sank in only now. The threshold to push to stock up is also likely to be quite high. While it is clear that mobile vendors like Qualcomm, TI, NXP and Broadcom will now go for their proprietary GPS chipsets effectively shutting out SiRF from a majority of the mobile market, a good portion of the convergence device market is still open for it to battle with the other smaller players. Even there, the battle will be tough given that companies like Atheros will now strive to bundle their GPS offerings with other peripheral technologies such as bluetooth and WLAN. So it remains to be seen how the company wishes to address this situation now.
The company needs some good design wins in the mobile space now to re-infuse investor confidence. And there is potential. It acquired Centrality Communications for a better positioning in the mobile market. Besides, it has active collaboration efforts with Intel for GPS in laptops, which is not bad considering Intel's path-breaking effort as the core of the Apple Air. If my suspicion is right, we will see more Intel processors in Apple's future convergence devices with smaller form factor than the Air. This bodes well for SiRF.I also think there is a strong possibility that Intel may make a move to buy SiRF.
So, while I am not surprised that the stocks plunged, especially given the reasons that led to the fall, I do think that $7.5 is a little too harsh. It will make a slow recovery this year but will perhaps never see the $40 highs of the past. The company has a strong patent portfolio and is still the GPS leader. Although the lack of diversification has come back to bite it, a strong alignment with a mobile vendor should do its fortunes a lot of good. With its technology leadership, I think it will overcome this crunch. It is down now, but not out yet!
Labels: Apple, Atheros, BroadCom, global locate, GPS, NXP, QualComm, sirf, U-Nav
NXP picks up GloNav
Friday, December 21, 2007
Labels: Atheros, freescale, GloNav, GPS, marvell, NXP, U-Nav