Showing posts with label HSDPA. Show all posts
Showing posts with label HSDPA. Show all posts

Nokia to use IDCC products in future?

Wednesday, June 4, 2008

With Nokia and InterDigital (IDCC) engaged in a prolonged legal battle over licensing issues, the title of this article is sure to raise more than a few eyebrows. I think that recent industry events make this an interesting but overlooked possibility. Here is why –

The IDCC-NXP connection: NXP has licensed IDCC’s 3G HSDPA ASIC design for its PNX6712 chip. The companies entered into this agreement for integration into NXP’s Nexperia cellular chipsets as early as August 2005. Talking about this during InterDigital’s 1st quarter 2008 conference call, its CFO Scott McQuilkin said, “We also completed our delivery of HSDPA technology to NXP and ASIC is now moving into production.”

The NXP-STM connection: STM and NXP entered into a JV last month merging their wireless businesses to acquire scale. You can read my extensive coverage of this event here and here. The formation of a solid number three player stints IDCC’s abilities to sell its SlimChip solution directly. But in the bigger scheme of things, it spells good news for the King of Prussia-based company as the JV widens its footprint. In the most recent quarter conference call, IDCC’s CEO William Merritt resonated this point saying, “Frankly we looked at the combination of ST Micro and NXP and said, ‘Great, they’re getting stronger and they have our IP’ and we love our licensees to be strong and pushing hard into the market..”

The STM-Nokia connection: Nokia last year decided on a multi-vendor sourcing strategy. It now sources 3G from both TI and STM. Additionally, it also transferred about 200 chipset design engineers to STM. This not only signals Nokia’s move away from chipset design, but also presents STM with the opportunity to grab more 3G business at Nokia. It is devoting R&D resources to baseband design and NXP’s team and product are an active part of the equation.

The performance conundrum: Data communication necessitates a better receiver design. Despite the design resources from Nokia, STM will take time to build a competitive solution on its own. On the other hand, the design that NXP has licensed from IDCC is one of the top-performing receivers today. Nokia cannot afford to lag in 3G performance especially considering its high-end mobile market competitors have good solutions. Samsung sources from Qualcomm and Infineon while Apple is expected to have an Infineon chipset in its impending 3G iPhone. So, for the moment, the IDCC design seems to be the most accessible ‘best’ 3G solution for Nokia.

In summary, as STM continues its 3G ramp up, it may use NXP’s design in its platform in the short-term. IDCC, by virtue of its license agreement with NXP, will directly benefit from this move. What is more, this will give IDCC a chance to be part of Nokia phones. Now, that begs another question. Are IDCC and Nokia factoring this in their licensing discussions?

Read the full article>>

New 3G performance leaders?

Thursday, April 3, 2008

Recently, Signals Research Group published an independent performance report comparing HSDPA solutions from various vendors. The test results, coming as they did from a credible firm, surprised many by concluding that InterDigital(IDCC), Infineon (IFX) and Icera were the winners. I was not surprised though.

Over the past few months, I have extensively covered InterDigital and its SlimChip solution. The SlimChip’s advantage comes from its advanced baseband receivers with firm theoretical underpinnings. Much like Qualcomm, InterDigital has a strong systems team that designs the optimal system first and then seeks to make the cost-performance trade-off. The SlimChip is well-positioned to complement the market-leading applications processors such as TI’s OMAP to break into the smart-phone market. For more coverage on InterDigital, I will refer you to my earlier articles here, here and here.

Infineon is also not a surprising topper at least for two reasons. Firstly, I am betting that Infineon will be in the impending 3G iPhone. The Apple angle implies that Infineon has to match the former’s push for innovation with a high-performance, low power chipset. Secondly, Infineon has a very friendly alliance with InterDigital. The Infineon chipset uses InterDigital’s 3G stack. Besides, I suspect that InterDigital has provided substantial baseband IP for this chipset including the advanced receiver algorithms that have made SlimChip superior. You can read my iPhone suspicions here and here.

Icera is a Bristol-based startup which has raised over $100 million in venture funding till date. Its Livanto solution is the world’s first wireless soft modem. Along with the Adaptive Software solution, Livanto supports HSDPA,WDCMA, GSM and EDGE. The software solution implies that very high precision advanced algorithms can be programmed without spinning a new chip. This not only allows for extremely good performance, but also implies that the Icera chipset can handle any improvements in the standard or receiver algorithm. You can find earlier coverage on Icera here.

I had suggested earlier that an alliance with InterDigital will do TI a world of good. Watch out for Icera as well. Soft modem is the future. This company founded by Broadcom and ST Microelectronics founders already has a pioneer status and can come at a much cheaper price than InterDigital if TI wants quick 3G capability.

In summary, the three companies are not surprising winners, after all. But the test results have challenged Qualcomm’s Unique Selling Proposition (USP) – its baseband performance. Qualcomm, for the moment, can rely on its economy of scale, service and support to stay ahead. This may also be broken if, for example, TI throws its weight behind InterDigital or Icera.

[Long Qualcomm, InterDigital at the time of writing]

Read the full article>>

Nuviphone - who is inside?

Friday, February 8, 2008

The Nuviphone has stirred my curiosity on one other front - the silicon inside the phone. The question I am itching to know - whose chipset forms the basis for the phone? Who is to the Nuviphone what Infineon is to the iPhone?

This also gives rise to other related questions like-
  • Who is the GPS chip provider?
  • Who provides bluetooth and WiFi capabilities for the phone? Is this a single-chip solution?
  • Whose chip does the phone use for touch-screen controls?
As an open fan of Qualcomm's engineering leadership, I like to look at the Snapdragon platform as the panacea for all integration woes and perhaps the heart of the Nuviphone. Here is an excerpt from my July 07 integration article -

"Qualcomm's Snapdragon platform has 3G cellular capability along with GPS functionalities. Plans are on to incorporate WLAN and blue-tooth into this platform. The company is already pitching this as the ultimate dream-solution for any dream-phone. The idea is fairly clear, provide to the phone manufacturers, this all-in-all solution at a cost they cannot resist."
The diagram above seems to illustrate everything that QCOM's all-in-all chipset has to offer. What is more, this is a superset of features that the Nuviphone advertises. The QSD8250 platform supports HSDPA, is GPS, WiFi and bluetooth capable. The GPS and bluetooth will come from its Snaptrack and RFMD bluetooth acquisition respectively. I am, however, not sure if the WiFi capabilities will come from Airgo, or if it is using the mobile WLAN players to reduce the time-to-market. Besides, the platform has a 1 GHz ARM-based processor and a 600 MHz DSP processor that will together make the phone a true mean machine. The chipsets are already shipping to customers. HTC seems to be one of its customers.

As far as the Snapdragon matching the Nuviphone's needs, I do not have visibility into the OS requirements for Garmin. The Nuviphone runs on Garmin's proprietary OS. The literature suggests that the Snapdragon is customizable for Windows mobile and Linux. I am guessing that if need be, writing the drivers for a new OS may not be an issue for QCOM.

Well, that is just my wishful thinking for the moment. I want the Nuviphone to be a great phone and cannot think of a better partner than QCOM for the venture.

Read the full article>>
Posted by Vijay Nagarajan at 7:00 PM 0 comments  

Gobi - WiMax a Go By!

Wednesday, October 24, 2007

QualComm announces Gobi. Gobi packs EV-DO and HSDPA capabilities in a single chip, a punch aimed at side-lining Intel-backed WiMax. Whether it originates from 'Go and Be' or it implies Go-Bi (for the two technologies), the product does not disguise its intent.

I am very happy to see this product, though I am not surprised. For one, I strongly believe that in order for QualComm to maintain its position in the semiconductor industry, it should start diversifying. I am betting on QualComm making greater strides in the PC/Notebook market. I do not wish to digress on these comments and will reserve them for an article to be published later on Sramana Mitra's site. Secondly, as I have often stressed in my earlier articles, the future of wireless is all about integration. The technologies have been defined for the next 10-15 years. It is about how these are packaged and made available to the user who wants it all in one gadget. So, this is a right step in that direction.

Will it be successful? I am optimistic about it. The reason is that it has gotten a lot of different folks excited. Laptop makers like HP are raving about it and the carriers are behind it. So, QCOM seems to have got the value-chain bottoms-up, at least that is the impression it wants to give. Contrast this with the situation in the mobile space where it is in loggerheads with a lot of handset makers and other chipset makers. The computer manufacturers stand to make money out of subscriptions as well. So, they may not be inhibited by the initial cost in their quest to make it happen. Carriers of course will back any technology that can grow their subscriptions meaningfully.

This being said, I am not sure about the single-day or other short-term subscription ideas that are doing rounds. The infrastructure set-up cost will not lend itself to such schemes. I can see tie-ups between carriers if longer contracts are signed. But perhaps, a slightly higher cost structure for the long contracts can help offset these short-term schemes that popularize the technology.

In the sequel
, I will look into what this means to QualComm among other things.

Read the full article>>
Posted by Vijay Nagarajan at 6:33 PM 0 comments  

V go with LTE

Friday, September 21, 2007

Carriers, Vodafone (VOD) and Verizon Wireless (VZ) have suggested that they will each go ahead with the 3GPP Long Term Evolution (LTE). This announcement signifies a stride ahead for LTE amidst the noise that Vodafone is making about dabbling with WiMax. This also sounds the death knell for the QualComm (QCOM) proprietary Ultra-Mobile BroadBand (UMB) as a competing 4G standard. While I will analyze the impact of this announcement in a later article, this is dedicated to removing a few popular misconceptions. I am a little disappointed with some of the half-informed and misguiding reports following this announcement. Among other things, I wish to re-emphasize the following points -
  • LTE is not a GSM technology, it is rather an evolution of the GSM standard
  • WCDMA/HSDPA that serve as the link between GSM and LTE is based on CDMA physical layer. In other words, the core over-the-air interface is similar in flavor to CDMA2000
  • UMB is not CDMA-based, but is rather an evolution of the CDMA2000 standard. In fact UMB and LTE are based on the same underlying Orthogonal Frequency Division Multiple Access (OFDMA) technology.
  • This may be bad for UMB, but not entirely for QualComm.
So, as a consequence -
  • Irrespective of whether UMB or LTE, or for that matter, WiMax wins, at the end of the day, CDMA as a technology is on its way out and even QualComm knows this.
  • Since the migration to UMB or LTE will have involved similar infra-structure overhauling, it makes sense for Verizon to go with LTE (I will elaborate on this in a subsequent article)
In summary, the notion of CDMA Vs GSM is very rudimentary and an analysis of the underlying technologies reveals much more in common than perceived and should be kept in mind as we look ahead into the futures of the companies with stakes in the battle.

Read the full article>>
Posted by Vijay Nagarajan at 4:45 PM 0 comments  

iPhone v2: Steve's 3G job

Wednesday, September 19, 2007

Steve Jobs, at the UK launch of iPhone, finally broke the silence and suggested that Apple (AAPL) was actively working on 3G. No surprises there. But what is important is his assertion about the power consumption of the 3G chip. There are four questions/points I would like to reflect on -
  • The 3G version, as I have already mentioned, suffers from a costlier chip also. The average price per 3G chip is closer to $25 as against single digit numbers for the Infineon chip in the iPhone today. Besides, the royalty structure for 3G amounts to about 28% of the average selling price of the 3G phone. Apple typically keeps its cost constant for more features. This will imply reduced margins from iPhone V2
  • The power consumption issue does open up the question of who the baseband supplier will be. Will it be QualComm (QCOM), which has made strides in power management since iPhone V1? Will it be Infineon that has been confirmed to be developing UMTS (3G) baseband chipsets for atleast 2 companies? And if so, where does the recent licensing deal between Apple and Interdigital (IDCC) fit in?
  • Who will supply the A-GPS capability for the iPhone?
  • Would iPhone V2 be HSDPA-enabled?
Answer to the second bullet will partially answer the other two that follow. I will re-visit a few of these questions and possibilities in subsequent articles. In the meanwhile, you could look at these lengthy essays that I had a few months ago.

Read the full article>>

4G-ing ahead?

Tuesday, August 28, 2007

A recent report from In-stat suggested that the much touted 4G technologies will take a while to roll-out. The time-frame predicted is between 2010 and 2012. Though the companies are battling it out to choose between Ultra-mobile Broadband (UMB), Long-term evolution (LTE) and WiMax, this time-frame suggests a rather slow deployment rate. This is not too surprising for some reasons as listed below -
  • The carriers are yet to monetize on the infra-structure they have built so far. So, even if they attempt to vigorously promote 4G, the investors are unlikely to authorize another 50 billion dollars for new OFDMA based infra-structure.
  • 3G is just getting popular, especially in the U.S. For example, AT&T (T) is slowly adding cities to its WCDMA roll-out. 4G will have to wait since a lot of these carriers are thus committed to 3G.
  • New carriers need to pick from the available candidates for core technology. Each is plagued by unique issues and the choice is thus not obvious. WiMax has mobility issues, UMB is solely QualComm's technology and the wireless value chain will be vary of this and infact want to avoid it.
  • LTE has just been completed as a standard and there are reports that most stumbling blocks of the Physical layer have been ironed out. QualComm (QCOM) and Ericsson are the only companies developing prototypes. All others are either struggling with their HSDPA or HSUPA solutions and are not even close to HSPA+, leave alone LTE. Not many have the deep pockets to run parallel tracks like these two giants can afford to.
  • Extensive field-testing has not been done with any of these technologies. Field testing, as many will agree, can spawn its own cycle of debug and development. And this will affect the availability of the devices even if the 700MHz spectrum and its winners are waiting with open hands.
So, while 4G holds a lot of promise and optimism, there are basic arguments that will prevent its quick deployment, no matter how fast it touts itself to be.

Read the full article>>
Posted by Vijay Nagarajan at 11:15 PM 0 comments  

Que Sera Sera, icera!

Saturday, July 14, 2007

Aha, here goes..

http://www.icerasemi.com/release.php?newsID=42

So let me add one more company to the already long-list of suitors that I have put up in this forum. Welcome icera semiconductors!

It is almost as if the company gels with the Apple brand rightaway with the latter's trade-mark 'i'! Jokes apart, icera has been talking for a while about having the industry-best HSDPA solution. And now they claim that an independent industry evaluation has come up with the same conclusion. They are indicated to be better than QualComm's next generation MSM7200. What is more, their Livanto® wireless soft modem, as the name indicates is completely software-centric. This is again something that Apple will like since they can then potentially look at designing a universal solution which does not need a different base-band chip for different regions. And that is not all, they offer dual-mode 2G/3G capabilities currently making them a ripe candidate fo V2. Their claims about lower power consumption is also a great plus.

This being said, icera only offers a 3GPP solution. So Apple, if they want to enter the CDMA2000 evolution path, would currently have to look beyond icera, presumably QualComm. But nothing prevents icera, with a guarantee from Apple, to license the CDMA IP from QualComm and develop their own solution using the know-hows from their WCDMA development. The second draw-back of course is the lack of an integrated Wi-Fi and GPS chipset. Another fine-point is that the performance demonstrated is for a two-antenna solution while Apple V2 is likely to be a one-antenna solution. So after all, their best-performing modem may not be compatible with Apple's plans. Nonetheless, they seem to have the capabilities to switch to the other receiver which should serve the iPhone's purpose. Also, my point is that if the solution is feasible for Apple (I mention feasibility because I am not sure if icera will have the economy of scales to match the bigger bidders in the pricing wars), the latter is more likely to retain the flexibility of a software upgrade for other softwares while also obtaining cheap Wi-Fi and GPS licenses from either their existing customers or their cut-throat competitors.

It seems that icera has something unique to sell. They may be rightly positioned to supply base-band capabilities to a lot of the smart-phones of the future. Most notably, a contract from Apple can make this UK-based soft-radio company the next hot property in wireless.

Read the full article>>
Posted by Vijay Nagarajan at 12:16 AM 0 comments  

The suitors for iPhone V2 - Part 1

Sunday, July 1, 2007

While the wireless industry as such does not want to believe that a single phone is capable of changing its dynamics, none of them are willing to risk it by betting against Apple and iPhone. They argue that Motorola with its RAZR only bit dust running into losses and laying off 3500 employees world-wide. But then, on the other hand, they are not able to ignore the force of evidence: Steve Jobs has hard-balled his way into profit-sharing with Cingular, a hitherto unheard-of practice in the industry. If a carrier can come around to believing that the iPhone can change their world, the decision-makers at the chip-set companies are unlikely to risk being left behind.

And so the story is, everyone who is a some-one in the 3G world wants a part of the iPhone pie. While this may be the desire, the eventuality may be too much for most vendors in this fragmented space to achieve. Very few have the capability to produce integrated chip-sets or even have the R&D budget to work on that and the power management aspects. These differentiators are likely to widen the rift between the top-of-the-line vendors and the others. For example, Agere that was acquired by LSI logic was working on a 3G chip. They will now have to work hard to get GPS and Wi-Fi capabilities, if they ever can. The situation is further accentuated by E911 being made mandatory. Realistically speaking, that leaves us with a few candidates at this stage unless something significant is in the cards for the next few months.

Infineon (IFX) deserves first mention since it already has a design win with Apple. Seemingly, it has a cheap solution which meets Apple's expectations on the power management-side. The next few days will further serve as testimony for the company. The customer satisfaction with the modem performance will either justify or put to death, Apple's confidence in Infineon. This being said, Infineon does not have a proven 3G solution on its own. However, Interdigital (IDCC) has a cross-licensing agreement with Infineon to be able to develop dual-mode chip-sets for GSM and WCDMA/HSDPA (but not extensively field-proven either). Interdigital, on its part may hope to use the iPhone and Infineon's relationship with Apple to wedge their way into V2. While, Infineon would gain licensing fees, a deal along these lines may auger very well for Interdigital. Long-known for the cut-throat IP litigations against Nokia and the other biggies, Interdigital seems to want to hit it big even in modem development. If it can strike a deal with Apple and also other smart-phone vendors, Interdigital may be on its way to getting a part, albeit a small one, of the cellular pie. After all, unless a transition happens it is very difficult for Interdigital to survive with the one-time IP license/litigation model. The biggest draw-back of the Infineon-Interdigital combination however is their lack of GPS or Wi-Fi capability. If Apple opts for either one of them, the iPhone will have to again seek separate designs for the Wi-Fi part, something to keep in mind given the power optimization and the other improvements sought moving forward.

In the next part, we will look at the other horses in this race

Read the full article>>
Posted by Vijay Nagarajan at 12:19 AM 0 comments